Tech giant Huawei unveiled new AI infrastructure meant to help boost compute power and allow the company to better compete with rival chipmaker Nvidia. At a keynote at its Huawei Connect conference on Thursday, Shenzhen, China-based Huawei announced new SuperPoD Interconnect technology that can link together up to 15,000 graphics cards, including Huawei’s Ascend AI chips, to increase compute power. This tech seems to be a competitor for Nvidia’s NVLink infrastructure, which facilitates high-speed communication between AI chips. Technology like this is critical for Huawei to better compete with semiconductors …
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